- 3C
-
semiconductor
- Chip inverted film crystal expandingline
- AUTOMATIC WAFER TEARING MACHINE
- COMPRESSION MOLDING MACHINE
- AOI DETECTOR
- AUTOMATIC WAFER LAMINATING MACHINE
- WAFER VACUUM COATING MACHINE
- INTELLIGENT TRANSMISSION SYSTEM
- MINI/MICRO LED APPLICATION SCENARIOS
- MINI/MICRO LED - COB MODULE SOLUTION
- MINI/MICRO LED - MIP PACKAGING SOLUTION
- INTELLIGENT EQUIPMENT
-
Hydrogen Energy
- INTRODUCTION TO HYDROGEN ENERGY
- ELECTROLYZER SMART FACTORY (2.5GWH ELECTROLYZER INTELLIGENT MANUFACTURING SOLUTION)
- ELECTROLYTIC CELL POLE FRAME VERTICAL MILLING AUTOMATIC LINE BODY
- ELECTROLYTIC CELL MACHINE FRAME VERTICAL CAR INTELLIGENT LINE BODY
- AUTOMATIC WELDING LINE FOR ELECTROLYTIC CELL PLATES
- ELECTROLYTIC CELL INTELLIGENT EQUIPMENT (STANDARD EQUIPMENT)
- INFORMATION SYSTEM (STANDARD MES)
- HYDROGEN STORAGE BOTTLE SMART FACTORY (SOLUTION)
- FUEL CELL SMART FACTORY (SOLUTION)
- INTRODUCTION TO LITHIUM BATTERIES
- LITHIUM ION CYLINDRICAL BATTERY STANDARD WIRE
- SQUARE SHELL BATTERY MODULE PACK STANDARD LINE (AUTOMATIC)
- STANDARD LINE FOR SQUARE SHELL BATTERY MODULE PACK (SEMI-AUTOMATIC)
- STANDARD WIRE FOR SOFT PACK BATTERY MODULE
- CELL THICKNESS MEASURING MACHINE
- BATTERY CELL ADHESIVE MACHINE
- CELL STACKER/MODULE LOADING EQUIPMENT
- CROSS LINE POLARITY DETECTION&POLE GUIDE ADDRESS
- CROSS LINE LASER WELDING MACHINE
- Customized equipment - photovoltaic
- Automotive Related Equipment
- SMART FACTORY
AUTOMATIC WAFER TEARING MACHINE
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AUTOMATIC WAFER TEARING MACHINEFully automatic wafer tearing machine applied to BGA, QFN
FC、FO、Memory During the film tearing process, this equipment has the characteristics of uniform film tearing speed, stable film tearing, no fragments, and strong compatibility. Suitable for all thicknesses up to 100um~
600um BG film, UV film, etc. It can be paired with UV glue remover according to process requirements.Detail









