Wafer Automatic Film Laminating Machine
Bright’s Wafer Automatic Film Laminating Machine is a technologically advanced semiconductor wafer grinding/thinning lamination and edge trimming equipment. The machine integrates core technologies including precise wafer alignment, film tension control, bubble removal rolling, and temperature-controlled cutting, achieving lamination accuracy and edge quality at internationally advanced levels. Supporting quick-change chucks for one-click compatibility with 8-inch and 12-inch wafers, covering 100~600μm BG tape with optional Notch cutting capability, it delivers UPH＞70PCS/H and a production yield rate of ≥99.99%, enabling high-efficiency flexible production.
Product application areas
(I) Equipment Overview & Applications
The fully automated wafer film laminating machine is independently developed by our company, which is applied to film laminating and edge cutting for wafer grinding and thinning process of semiconductor.
(II) Key Specs
Product Size: 8-inch / 12-inch
Equipment Capacity: UPH > 70PCS/H （depending on specific process）
BG Film Applicable Scope: 100~600μm BG film full coverage，can have Notch cutting according to process requirement
Equipment Size: L1450 × W1850 × H2120mm (exclude three color light)
Yield Rate: ≥99.99%
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Wafer Automatic Film Laminating MachineDetail
