Bright’s Mini&Micro LED Intelligent Manufacturing Solution fully covers both MIP packaging and COB integrated packaging processes, providing complete end-to-end services from front-end substrate inspection to back-end cabinet assembly. Over 80% of key process equipment is self-developed, with support for full-line automation and information integration, empowering MLED manufacturing with efficient, stable, and intelligent upgrades.

Bright Technology provides a one-stop intelligent equipment solution covering the entire Mini/Micro LED MIP packaging process, from front-end chip handling and substrate preparation, through die bonding, reflow soldering, molding, and dicing, to probing, sorting, and film expansion. Over 80% of core process equipment is self-developed. The solution supports full-line automation integration with seamless MES and smart factory connectivity, enabling efficient, stable, and intelligent mass production for the MLED industry.

Bright’s Blue Film Flip-Chip and Wafer Expansion Automatic Line is a fully automatic system independently developed for Mini/Micro LED chip blue film transfer and expansion, an industry-first innovation. The line integrates transfer, expansion, and other core processes, streamlining the workflow to improve production efficiency and yield. Equipped with static elimination throughout all stations and data traceability, it supports QR code binding and MES system communication. The line includes a dicing frame loader, blue film transfer machine, blue film expander, dicing frame peeling machine, and expansion ring unloader. Compatible with 6-inch expansion rings and 200×200/240×240mm blue films, it supports quick changeover of tooling for multiple machine types with one-click software switching, and can operate in either inline or standalone mode.

Bright’s Intelligent Molding Press is a semiconductor packaging solution designed for MiniLED MIP and COB module molding and chip encapsulation. Utilizing a release film-assisted process, it precisely presses and cures adhesive in a vacuum environment to form a dense protective layer, providing waterproof, dustproof, and impact protection for chips and LEDs. The equipment integrates mold temperature control, multi-channel vacuum exhaust, and vision-guided robotics. Available in 16-inch, 19-inch, and 1-to-4 configurations, with max board sizes up to 300×400mm, it supports standalone or inline operation to meet diverse packaging requirements.

Bright’s Module Film Applicator is designed for COB and GOB lamination processes in Mini/Micro LED manufacturing, integrating flat lamination, offset lamination, and roller lamination into one system. Compatible with COB PCBs up to 220×360mm, with core functions including release liner peeling, vision alignment (optional), and easy peel tape (optional).

It is designed for for foam removal after display module lamination and pressure holding and shaping process. By putting the laminated module board into vacuum and positive press cavities , the machine combines technologies including heating device, even heating and temperature control of modules, vacuum de-foaming and cavity sealing, press shaping and cavity locking and sealing, negative and positive pressure control and maintaining to ensure stable and reliable process, bubble free and firm lamination.

It is specially designed for incoming materials of BT and PCB, used for detecting tiny expansion and shrinkage deviations of pad dimensions via visual inspection. Based on the ultra-large field-of-view vision system and high-precision positioning technology, the equipment automatically measures the dimensions of the effective area and calculates the expansion and shrinkage rate, classifies products according to set standards, provides a reliable process basis for subsequent processes, effectively ensures parameter accuracy and improves overall quality.

The Blue Film Flipping Machine is an industry-first patented equipment, specifically designed for reverse transfer of chips from old blue film to new blue film. It fully automates the flipping and transfer process. The system integrates core technologies including blue film supply, anti-stick peeling, precision solvent application control, debonding and adhesion activation. The scraper is wear-resistant, non-stick, and will not damage the carrier board. It accommodates chip blue film specifications of 200×200 mm and 240×240 mm.

This is a fully automatic wafer expanding equipment developed by our company, which is used to transfer blue film chips from the mounting ring to the expanding ring and accurately expand the chip spacing by a set multiple.
The equipment integrates chip transfer, expanding ring assembly, wafer expansion, trimming, identification, labeling and mounting ring reflow, supports electric numerical control of expansion multiple, visual identification and online dimension monitoring, features high precision and fully automated operation, and is suitable for standalone or in-line production. The equipment accommodates 6″ and 7.33″ expansion rings, as well as blue film specifications of 200×200 mm and 240×240 mm.

It integrates high speed electrical performance test, cosmetic inspection, sorting and bonding for semiconductor packaging, having features of high speed, high efficiency, high accuracy and stability. It can operate standalone as well as in line, being compatible with manual, crane and ground rail loading and unloading.

It integrates high-pressure pure water washing, high-speed centrifugal debris removal and high-efficiency air knife drying, and is characterized by high-efficiency cleaning, thorough purification, quick drying and reliable operation. The equipment can operate standalone or in line, and is compatible with various loading and unloading modes. It meets the high-cleanliness and high-efficiency demands of semiconductor production.

Loader/Unloader mainly includes: Horizontal Material Box Loading and Unloading Machine, Vertical Material Box Loading and Unloading Board Machine, Material Box Loading and Unloading Machine

The intelligent conveying system is the tailor-made solution for automatic logistic conveying of Mini&Micro LED manufacturing, integrating high flexibility, efficiency and intelligence into one. By integrating automated equipment, it combines smart control system CIM to achieve accurate positioning of base board, efficient conveying smart diversion and real-time monitoring of full procedure, supporting automated loading and unloading and transit buffering. It can effectively improve production efficiency and product yield rate, reduce operation cost and facilitate smart mass production.

Semiconductor Wafer Intelligent Manufacturing Solution——Specialized in grinding and dicing process of semiconductor packaging and front-end FAB manufacturing, provide high precision smart equipment and consumable materials in the entire manufacturing procedures of grinding, dicing, cleaning, film lamination, film de-lamination,, AOI test, injection molding and test and provide turnkey service for smart factory planning and upgrading.

Bright’s Automatic Wafer Vacuum Taping Machine is designed for semiconductor wafer etching and other processes, providing precision cutting and vacuum environment lamination of protective films. The equipment integrates core technologies including multi-chamber high vacuum control, non-contact wafer positioning and handling, precise film tension control, and temperature-controlled cutting, delivering high vacuum accuracy and excellent process consistency. Supporting one-click switching between 8-inch and 12-inch wafers, compatible with various wafer and film types, maintaining a dynamic Class100 cleanroom environment, achieving UPH≥20PCS/H and a production yield rate of ≥99.99%, meeting the stringent requirements of high-end semiconductor processes. is designed for semiconductor wafer etching and other processes, providing precision cutting and vacuum environment lamination of protective films. The equipment integrates core technologies including multi-chamber high vacuum control, non-contact wafer positioning and handling, precise film tension control, and temperature-controlled cutting, delivering high vacuum accuracy and excellent process consistency. Supporting one-click switching between 8-inch and 12-inch wafers, compatible with various wafer and film types, maintaining a dynamic Class100 cleanroom environment, achieving UPH≥20PCS/H and a production yield rate of ≥99.99%, meeting the stringent requirements of high-end semiconductor processes.

Bright’s Wafer Automatic Film Laminating Machine is a technologically advanced semiconductor wafer grinding/thinning lamination and edge trimming equipment. The machine integrates core technologies including precise wafer alignment, film tension control, bubble removal rolling, and temperature-controlled cutting, achieving lamination accuracy and edge quality at internationally advanced levels. Supporting quick-change chucks for one-click compatibility with 8-inch and 12-inch wafers, covering 100~600μm BG tape with optional Notch cutting capability, it delivers UPH＞70PCS/H and a production yield rate of ≥99.99%, enabling high-efficiency flexible production.

Bright’s Automated Wafer Film Peeling Machine is designed for tape peeling processes in BGA, QFN, FC, FO, Memory, and other packaging applications, compatible with BG tape and UV tape ranging from 100μm to 600μm in thickness. The machine features uniform peeling speed, stable operation, fragment-free performance, and strong compatibility. Supporting 8-inch to 12-inch wafer sizes, it achieves UPH≥70PCS/H, maintains a dynamic Class1000 cleanroom environment, and can be paired with a UV irradiation unit as needed, delivering a production yield rate of ≥99.99%.

Bright’s AOI Inspection Machine is designed for chip dicing process quality control, inspecting cutting dimensions and appearance. Powered by independently developed vision systems and algorithms, it supports both front and back side inspection. Compatible with products sized L100×W72mm (customizable), with 5μm detection accuracy, UPH≥200PCS/H, and a yield rate of ≥99.8%. Supports standalone or inline operation, compatible with manual and overhead crane loading.