Bright’s Automatic Wafer Vacuum Taping Machine is designed for semiconductor wafer etching and other processes, providing precision cutting and vacuum environment lamination of protective films. The equipment integrates core technologies including multi-chamber high vacuum control, non-contact wafer positioning and handling, precise film tension control, and temperature-controlled cutting, delivering high vacuum accuracy and excellent process consistency. Supporting one-click switching between 8-inch and 12-inch wafers, compatible with various wafer and film types, maintaining a dynamic Class100 cleanroom environment, achieving UPH≥20PCS/H and a production yield rate of ≥99.99%, meeting the stringent requirements of high-end semiconductor processes. is designed for semiconductor wafer etching and other processes, providing precision cutting and vacuum environment lamination of protective films. The equipment integrates core technologies including multi-chamber high vacuum control, non-contact wafer positioning and handling, precise film tension control, and temperature-controlled cutting, delivering high vacuum accuracy and excellent process consistency. Supporting one-click switching between 8-inch and 12-inch wafers, compatible with various wafer and film types, maintaining a dynamic Class100 cleanroom environment, achieving UPH≥20PCS/H and a production yield rate of ≥99.99%, meeting the stringent requirements of high-end semiconductor processes.