Automated Wafer Film Peeling Machine
Bright’s Automated Wafer Film Peeling Machine is designed for tape peeling processes in BGA, QFN, FC, FO, Memory, and other packaging applications, compatible with BG tape and UV tape ranging from 100μm to 600μm in thickness. The machine features uniform peeling speed, stable operation, fragment-free performance, and strong compatibility. Supporting 8-inch to 12-inch wafer sizes, it achieves UPH≥70PCS/H, maintains a dynamic Class1000 cleanroom environment, and can be paired with a UV irradiation unit as needed, delivering a production yield rate of ≥99.99%.
Product application areas
(I) Equipment Overview & Applications
The full-automatic wafer film peeling machine is applied to the film peeling process in BGA, QFN, FC, FO, Memory and other manufacturing processes. It is suitable for all types of BG films, UV films and others with a thickness ranging from 100μm to 600μm. It can be paired with a UV degumming machine for operation according to process requirements.
(II) Key Specs
product size: 8 inch~12 inch
equipment capacity: UPH≥70PCS/H
cleanliness level: Dynamic Class1000
equipment size: L2000*W2100*H2200mm
yield rate: ≥99.99%
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Automated Wafer Film Peeling MachineDetail
