Mini&Micro LED Intelligent Manufacturing Solution
Bright’s Mini&Micro LED Intelligent Manufacturing Solution fully covers both MIP packaging and COB integrated packaging processes, providing complete end-to-end services from front-end substrate inspection to back-end cabinet assembly. Over 80% of key process equipment is self-developed, with support for full-line automation and information integration, empowering MLED manufacturing with efficient, stable, and intelligent upgrades.
Product application areas
Mini&Micro LED Intelligent Manufacturing Solution ——In packaging manufacturing, we simultaneously support MIP packaging process ( package chips into RGB/Single-color light beads) and COB integrated packaging process, provide solution covering frond and back stage process. Including the whole manufacturing procedure from expansion and shrinkage inspection in BT/PCB substrate incoming material stage, marking and cleaning, to wafer expansion of blue tape chip, BT bonding, PCB solder paste brushing and die bonding inspection; from pre-furnace inspection and rework , SMT reflow soldering, post-furnace test and rework, to molding press packaging and surface film lamination; also including trimming edge cleaning and edge coating treatment, SMT light bead spot inspection, module-level aging and calibration, packing and delivery to cabinet assembly and packing finished products,etc.
