MINI/MICRO LED - MIP PACKAGING SOLUTION
Bright Technology provides a one-stop intelligent equipment solution covering the entire Mini/Micro LED MIP packaging process, from front-end chip handling and substrate preparation, through die bonding, reflow soldering, molding, and dicing, to probing, sorting, and film expansion. Over 80% of core process equipment is self-developed. The solution supports full-line automation integration with seamless MES and smart factory connectivity, enabling efficient, stable, and intelligent mass production for the MLED industry.
Product application areas
A one-stop solution for lamp bead packaging process using MIP technology (chip packaging into RGB/monochrome lamp beads), including core equipment, key automatic line bodies, smart factory systems, MES, robot applications, etc.
