（一）Equipment Introduction & Application Scenarios
The intelligent molding press is a semiconductor packaging equipment specially designed for film lamination of MiniLED MIP lamp beads and COB modules as well as chip encapsulation. It adopts the release film assisted packaging process to precisely flatten and cure the adhesive in a vacuum environment, forming a dense protective film to achieve waterproof, dustproof and anti-collision protection for chips and lamp beads. The equipment integrates technologies such as mold constant temperature control, multi-channel vacuum exhaust and vision-positioning manipulator, supports multiple models from 1-to-1 to 1-to-4 configurations, can operate standalone or in line, and meets diverse packaging requirements.
（二）Main Parameter
Model Classification：
16 inch molding press ，maximum size of single board (mm):190*320
19 inch molding press ，maximum size of single board(mm):300*400
1-to-4 molding press machine, maximum size of single board(mm):300*400
Mold Type：MIP BT board 1-to-1, 1-to-two, 1-to-four; COB PCB board 1-to-1
Production Efficiency：5~6 minutes/mold （depending product process）
