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BLUE FILM FLIP-CHIP AND WAFER EXPANSION AUTOMATIC LINEBright’s Blue Film Flip-Chip and Wafer Expansion Automatic Line is a fully automatic system independently developed for Mini/Micro LED chip blue film transfer and expansion, an industry-first innovation. The line integrates transfer, expansion, and other core processes, streamlining the workflow to improve production efficiency and yield. Equipped with static elimination throughout all stations and data traceability, it supports QR code binding and MES system communication. The line includes a dicing frame loader, blue film transfer machine, blue film expander, dicing frame peeling machine, and expansion ring unloader. Compatible with 6-inch expansion rings and 200×200/240×240mm blue films, it supports quick changeover of tooling for multiple machine types with one-click software switching, and can operate in either inline or standalone mode.Detail -
INTELLIGENT MOLDING PRESS MACHINEBright’s Intelligent Molding Press is a semiconductor packaging solution designed for MiniLED MIP and COB module molding and chip encapsulation. Utilizing a release film-assisted process, it precisely presses and cures adhesive in a vacuum environment to form a dense protective layer, providing waterproof, dustproof, and impact protection for chips and LEDs. The equipment integrates mold temperature control, multi-channel vacuum exhaust, and vision-guided robotics. Available in 16-inch, 19-inch, and 1-to-4 configurations, with max board sizes up to 300×400mm, it supports standalone or inline operation to meet diverse packaging requirements.Detail -
MODULE FILM APPLICATORBright’s Module Film Applicator is designed for COB and GOB lamination processes in Mini/Micro LED manufacturing, integrating flat lamination, offset lamination, and roller lamination into one system. Compatible with COB PCBs up to 220×360mm, with core functions including release liner peeling, vision alignment (optional), and easy peel tape (optional).Detail -
VACUUM HOT PRESS SHAPING MACHINEIt is designed for for foam removal after display module lamination and pressure holding and shaping process. By putting the laminated module board into vacuum and positive press cavities , the machine combines technologies including heating device, even heating and temperature control of modules, vacuum de-foaming and cavity sealing, press shaping and cavity locking and sealing, negative and positive pressure control and maintaining to ensure stable and reliable process, bubble free and firm lamination.Detail -
SMART EXPANSION AND SHRINKAGE INSPECTION MACHINEIt is specially designed for incoming materials of BT and PCB, used for detecting tiny expansion and shrinkage deviations of pad dimensions via visual inspection. Based on the ultra-large field-of-view vision system and high-precision positioning technology, the equipment automatically measures the dimensions of the effective area and calculates the expansion and shrinkage rate, classifies products according to set standards, provides a reliable process basis for subsequent processes, effectively ensures parameter accuracy and improves overall quality.Detail -
BLUE FILM FLIPPING MACHINEThe Blue Film Flipping Machine is an industry-first patented equipment, specifically designed for reverse transfer of chips from old blue film to new blue film. It fully automates the flipping and transfer process. The system integrates core technologies including blue film supply, anti-stick peeling, precision solvent application control, debonding and adhesion activation. The scraper is wear-resistant, non-stick, and will not damage the carrier board. It accommodates chip blue film specifications of 200×200 mm and 240×240 mm.Detail -
BLUE FILM WAFER EXPANSION MACHINEThis is a fully automatic wafer expanding equipment developed by our company, which is used to transfer blue film chips from the mounting ring to the expanding ring and accurately expand the chip spacing by a set multiple.
The equipment integrates chip transfer, expanding ring assembly, wafer expansion, trimming, identification, labeling and mounting ring reflow, supports electric numerical control of expansion multiple, visual identification and online dimension monitoring, features high precision and fully automated operation, and is suitable for standalone or in-line production. The equipment accommodates 6″ and 7.33″ expansion rings, as well as blue film specifications of 200×200 mm and 240×240 mm.Detail -
PROBE TESTING &SORTING &BONDING MACHINEIt integrates high speed electrical performance test, cosmetic inspection, sorting and bonding for semiconductor packaging, having features of high speed, high efficiency, high accuracy and stability. It can operate standalone as well as in line, being compatible with manual, crane and ground rail loading and unloading.Detail -
DICING&CLEANING MACHINEIt integrates high-pressure pure water washing, high-speed centrifugal debris removal and high-efficiency air knife drying, and is characterized by high-efficiency cleaning, thorough purification, quick drying and reliable operation. The equipment can operate standalone or in line, and is compatible with various loading and unloading modes. It meets the high-cleanliness and high-efficiency demands of semiconductor production.Detail -
AUTOMATIC LOADING AND UNLOADINGLoader/Unloader mainly includes: Horizontal Material Box Loading and Unloading Machine, Vertical Material Box Loading and Unloading Board Machine, Material Box Loading and Unloading MachineDetail -
Intelligence Conveying SystemThe intelligent conveying system is the tailor-made solution for automatic logistic conveying of Mini&Micro LED manufacturing, integrating high flexibility, efficiency and intelligence into one. By integrating automated equipment, it combines smart control system CIM to achieve accurate positioning of base board, efficient conveying smart diversion and real-time monitoring of full procedure, supporting automated loading and unloading and transit buffering. It can effectively improve production efficiency and product yield rate, reduce operation cost and facilitate smart mass production.Detail
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