MODULE FILM APPLICATOR
Bright’s Module Film Applicator is designed for COB and GOB lamination processes in Mini/Micro LED manufacturing, integrating flat lamination, offset lamination, and roller lamination into one system. Compatible with COB PCBs up to 220×360mm, with core functions including release liner peeling, vision alignment (optional), and easy peel tape (optional).
Product application areas
(I) Equipment Introduction & Application Scenarios
It is specially designed for COB and GOB lamination process during Mini/Micro LED manufacturing. The equipment combines flat, offset and roller lamination modes via high-precision temperature control and multi-stage pressure rubber rollers, delivering a bubble-free, chip-free, wrinkle-free lamination process. It can effectively optimize light and enhance ink color consistency and improve visual color difference when high contrast and low power consumption .
(II) Main Parameter
Application Process Usage: COB module board, no need epoxy resin package，direct vacuum application of black film; COB PCB maximum size 220*360mm
Production Efficiency: 20S/PCS
Yield Rate: ≥99.8%
