PROBE TESTING &SORTING &BONDING MACHINE
It integrates high speed electrical performance test, cosmetic inspection, sorting and bonding for semiconductor packaging, having features of high speed, high efficiency, high accuracy and stability. It can operate standalone as well as in line, being compatible with manual, crane and ground rail loading and unloading.
Product application areas
(I) Equipment Introduction
It integrates high speed electrical performance test, cosmetic inspection, sorting and bonding for semiconductor packaging, having features of high speed, high efficiency, high accuracy and stability. It can operate standalone as well as in line, being compatible with manual, crane and ground rail loading and unloading.
(II) Main Parameter
– Capacity: UPH≥35K/H(depending on product type)
– Product size: ≥ L0.6×W0.3mm (customizable)
– Yield: ≥99.8%
