DICING&CLEANING MACHINE
It integrates high-pressure pure water washing, high-speed centrifugal debris removal and high-efficiency air knife drying, and is characterized by high-efficiency cleaning, thorough purification, quick drying and reliable operation. The equipment can operate standalone or in line, and is compatible with various loading and unloading modes. It meets the high-cleanliness and high-efficiency demands of semiconductor production.
Product application areas
(I) Equipment Introduction & Application Scenarios
It integrates high-pressure pure water washing, high-speed centrifugal debris removal and high-efficiency air knife drying, and is characterized by high-efficiency cleaning, thorough purification, quick drying and reliable operation. The equipment can operate standalone or in line, and is compatible with various loading and unloading modes.
(II) Main Parameter
– Capacity: UPH≥180PCS/H（depend on debris status）
– Yield: ≥99.8%
– Product size: L100×W72mm (customizable)
