Bright’s Automatic Wafer Vacuum Taping Machine is designed for semiconductor wafer etching and other processes, providing precision cutting and vacuum environment lamination of protective films. The equipment integrates core technologies including multi-chamber high vacuum control, non-contact wafer positioning and handling, precise film tension control, and temperature-controlled cutting, delivering high vacuum accuracy and excellent process consistency. Supporting one-click switching between 8-inch and 12-inch wafers, compatible with various wafer and film types, maintaining a dynamic Class100 cleanroom environment, achieving UPH≥20PCS/H and a production yield rate of ≥99.99%, meeting the stringent requirements of high-end semiconductor processes. is designed for semiconductor wafer etching and other processes, providing precision cutting and vacuum environment lamination of protective films. The equipment integrates core technologies including multi-chamber high vacuum control, non-contact wafer positioning and handling, precise film tension control, and temperature-controlled cutting, delivering high vacuum accuracy and excellent process consistency. Supporting one-click switching between 8-inch and 12-inch wafers, compatible with various wafer and film types, maintaining a dynamic Class100 cleanroom environment, achieving UPH≥20PCS/H and a production yield rate of ≥99.99%, meeting the stringent requirements of high-end semiconductor processes.

Bright’s Wafer Automatic Film Laminating Machine is a technologically advanced semiconductor wafer grinding/thinning lamination and edge trimming equipment. The machine integrates core technologies including precise wafer alignment, film tension control, bubble removal rolling, and temperature-controlled cutting, achieving lamination accuracy and edge quality at internationally advanced levels. Supporting quick-change chucks for one-click compatibility with 8-inch and 12-inch wafers, covering 100~600μm BG tape with optional Notch cutting capability, it delivers UPH＞70PCS/H and a production yield rate of ≥99.99%, enabling high-efficiency flexible production.

Bright’s Automated Wafer Film Peeling Machine is designed for tape peeling processes in BGA, QFN, FC, FO, Memory, and other packaging applications, compatible with BG tape and UV tape ranging from 100μm to 600μm in thickness. The machine features uniform peeling speed, stable operation, fragment-free performance, and strong compatibility. Supporting 8-inch to 12-inch wafer sizes, it achieves UPH≥70PCS/H, maintains a dynamic Class1000 cleanroom environment, and can be paired with a UV irradiation unit as needed, delivering a production yield rate of ≥99.99%.

Bright’s AOI Inspection Machine is designed for chip dicing process quality control, inspecting cutting dimensions and appearance. Powered by independently developed vision systems and algorithms, it supports both front and back side inspection. Compatible with products sized L100×W72mm (customizable), with 5μm detection accuracy, UPH≥200PCS/H, and a yield rate of ≥99.8%. Supports standalone or inline operation, compatible with manual and overhead crane loading.